The Raith eLINE Plus enables controlled error- and stitch-free fabrication of nano- and microstructures. Our experimental achieved minimum feature size on SiOx for a thin liftoff metallization process is around 9nm. Unique features of the system are: up to 27 mm variation along the z-coordinate; a 4 inch laser interferometer stage for movement and pattern placement in the nm range; a thermal field emission filament for ultrahigh resolution in all operation modes; tunable electron energy for damage-free imaging; and range of detectors, e.g. Everhart Thornley SE detector, InLens SE detector and angle selective BSE detector.
For more information please contact Stefan Kauschke.